Semiconductor/ATE

High-Precision PCB Solutions for Semiconductor Testing & Validation

We specialize in sourcing high-reliability PCBs for the Semiconductor and Automated Test Equipment (ATE) industry. These boards are used in environments that demand ultra-tight tolerances, low signal distortion, and superior thermal stability, supporting applications from chip-level testing to final product validation.

Our solutions enable robust testing across the semiconductor development cycle, including burn-in boards, load boards, probe cards, interface boards, and substrate carriers for high-frequency, high-pin-count devices.

Importance of PCB Quality in Semiconductor/ATE Applications

In semiconductor testing, PCBs are integral to ensuring accuracy and repeatability. Poor board quality or material selection can result in signal degradation, false test failures, and reduced yield. Our focus is on delivering boards that meet the highest technical standards to enable high-throughput testing and long-term performance.

Key Features
  • Ultra-Fine Line / Space: Down to 2 mils (50µm) for dense pin mapping
  • Low-Loss Dielectrics: For high-speed digital and RF testing
  • High-Layer Count Stackups: 10+ layers with blind, buried, and stacked vias
  • Controlled Impedance & Signal Integrity: Tight ±5% impedance control across traces
  • Thermal Management: Heavy copper, thermal vias, and dissipative substrate options
  • High-Density Interconnect (HDI): Microvias and sequential lamination for dense I/O layouts
  • Surface Finish Options: ENIG, ENEPIG, hard gold for probe contact durability
Manufacturing Standards & Testing

We source from ISO-certified and industry-approved manufacturing partners with capabilities including

  • AOI, X-ray, and electrical testing
  • IPC Class 2 and Class 3+ production
  • Statistical process control (SPC) and first article inspection (FAI)
  • Material traceability and lot-level documentation

Our boards meet or exceed standards for semiconductor-grade reliability, ensuring compatibility with major ATE platforms including Teradyne, Advantest, SPEA, and others.

Applications
  • Burn-in Boards: Extended thermal stress testing for early failure detection
  • Load Boards: Interface between ATE system and device under test (DUT)
  • Probe Cards: Wafer-level testing of ICs
  • Interposers / Substrate Boards: High-frequency signal routing and connection
  • Final Test Boards: System-level evaluation of packaged ICs and SoCs
Why Choose makemypcb.com?

Simply put, it is because of our sourcing expertise for highly technical, time-sensitive PCB requirements in the semiconductor sector. Our strategic manufacturing partnerships ensure that you receive boards with:

  • Tight tolerances
  • Repeatable quality
  • On-time delivery
  • Full traceability and support

We understand the challenges of semiconductor development—and we’re here to help you test with confidence.

From wafer to final package, we source the PCBs that keep your chips moving forward.

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