Rigid & HDI

High-Density Interconnect and Rigid PCB Solutions for Complex Electronics

As your technology and sourcing partner, we find solutions for Rigid and HDI (High-Density Interconnect) PCBs used in space-constrained, high-performance electronic applications. Designed for today’s compact, multilayer designs, our rigid and HDI boards enable increased functionality, reduced size, and enhanced electrical performance across industries such as consumer electronics, medical devices, automotive, aerospace, and industrial control systems.

What Are Rigid & HDI PCBs?

Rigid PCBs: Consist of solid, inflexible substrates such as FR-4, polyimide, or high-Tg materials, offering mechanical stability and multi-layer support
HDI PCBs: Feature high wiring density, microvias, blind/buried vias, and fine lines/spaces, allowing for more complex routing and higher component density in smaller footprints

HDI technology is essential for enabling miniaturization, signal integrity, and layer count reduction in high-speed, high-performance electronic designs.

Key Features

Microvia Technology: Laser-drilled microvias, stacked or staggered, for high-density layer interconnection
Blind/Buried Vias: Enables efficient use of inner layers without compromising board size
Fine Line/Space Capabilities: Down to 50μm (2 mil) or better for advanced signal routing
Sequential Lamination: Supports multiple HDI cycles for complex, multilayer designs
High-Tg and Low-CTE Materials: Improves thermal stability and reduces mechanical stress
Improved Signal Integrity: Through shorter traces, tighter impedance control, and low crosstalk

Manufacturing Capabilities

Our manufacturing partners are equipped with state-of-the-art HDI fabrication technologies, including:

Laser Direct Imaging (LDI)
Automated Via Filling and Planarization
Sequential Lamination with Press-Fit Registration
Controlled Impedance Testing
X-ray, AOI, and electrical testing for Class 2 & 3 standards

Boards can be fabricated to IPC-6012 Class 2, 3, or 3A specifications depending on performance and reliability requirements.

Applications:

Smartphones & Tablets: Compact, high-layer count boards with fine-pitch components
Medical Equipment: Implantable devices, diagnostic imaging, miniaturized modules
Automotive Electronics: ECU, ADAS, infotainment, and EV battery management systems
Aerospace & Military: Avionics, radar, satellite systems, and ruggedized electronics
Industrial Automation: Compact controllers, sensors, and embedded computing

Why Choose MakeMyPCB.com?

With over 20 years of combined experience in sourcing complex PCBs, we provide expert guidance and access to a global network of proven manufacturers. Whether you’re developing a high-layer rigid board or a multi-cycle HDI PCB, we ensure consistent quality, tight tolerances, and on-time delivery – so your designs go from concept to production without compromise.

Partner with us for precision-built rigid and HDI PCBs that power the most advanced electronics.

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